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14th Annual IEEE International Mixed-Signals, Sensors, and Systems Testing Workshop (IMS3TW'08)

June 18-20, 2008
Renaissance Hotel Harbourside
Vancouver, Canada

ims3tw.tttc-events.org

CALL FOR PAPERS
Scope -- Submissions -- Contact -- Committees

Scope & Purpose

The rapid pervasion of micro/nanoelectronics into various application fields like biology, chemistry, mechanics, optics, etc. is fostering unprecedented types of heterogeneous integrated systems and associated interfaces between these previously largely separate domains. Microsystems that combine advanced sensors and actuators with embedded, high-performance microprocessors are enabling an endless list of new applications in life sciences, aerospace, the environment, communications, etc. The design and test of such heterogeneous systems presents formidable challenges. In particular, as the inherent quality and reliability of the fundamental building blocks generally decreases with scale, the number of test and design-for-test, diagnosability, -manufacturability, -reliability considerations grows rapidly and their importance soars.  The test of such systems is a multidimensional challenge that grows in criticality with increased levels of integration. Test requirements often only implied that individual or multiple signals of a specific nature needed to be observed or monitored. For heterogeneous systems, a mixture of different types of signals observed and/or monitored at different levels of integration or packaging, will need to be the focus of test procedures, for both low and high volume levels of production. In addition to the mixture of signals, a mixture of processes will need to be developed and implemented to encompass signal sensing, conversion and conditioning. Reliability assessment and external and/or self-diagnosis and -repair will become critical facets of such systems.

One and a half decade ago the IEEE Mixed-Signal Test Workshop (IMSTW) was inaugurated as a forum focused on test and design for test issues related to systems encompassing digital and analog electrical signals.  In view of  accelerated developments in heterogeneous design and production, in 2008 IMSTW will include new topics focusing on challenges and solutions associated with test, design for test, reliability and manufacturability of heterogeneous types of systems in emergence or envisaged in the near to longer terms.  Renamed to include sensors and systems, the new IMS3TW aims to bring research and technical expertise for the next generation of devices, circuits and systems. IMS3TW will continue to address the traditional technology spectrum of IMSTW, in particular all aspects of analog, mixed-signal, and RF testing, but with increased attention to all aspects of current design complexity (e.g., parametric variability, power consumption, temperature effects). Guaranteeing design robustness for the new generation of nanoelectronic devices may need to exploit self-monitoring functionality (such as self-test/-calibration), allowing the circuit or system to adapt to varying circuit parameters or functional demands. Built-in sensors can play a crucial role to facilitate device adaptability and are therefore within the scope of IMS3TW.

Primary Topics of Interest include:

Test & Design for (on/off-line) Test

Verification & Design for Verification

Reliability & Design for Reliability

Monitoring/Diagnosis & Design for Debug/Diagnosis

Fault and Error Modelling & Simulation

Fault Tolerance

Pertaining to the following systems or underlying technologies:

Analog/Mixed-Signal Circuits
Biomedical Circuits & Systems

Lab-on-Chip
MEMs

RF & Wirelessly Controlled Devices

Microfluidics

Optoelectronics & Photonics

Heterogeneous Systems

Drug Delivery Microsystems

Implantable Devices

Submissions

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Prospective authors are invited to submit papers on the topics of interest.  Submissions should be via the workshop web-site and consist of either an extended summary of at least 750 words or a full paper. Intent is to have the accepted papers be published in a IEEE Computer Society Proceedings available on the IEEE digital library.

Key Dates:

Submission deadline: March 15th, 2008
Notification of acceptance: April 15th, 2008
Camera-ready full papers: May 1st, 2008

Contact

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Program Information

Bozena Kaminska
Simon Fraser University
Burnaby, BC, Canada
Tel. : +1 778.782.6855
E-mail: kaminska@sfu.ca

General Information

André Ivanov
University of British Columbia
Vancouver, BC, Canada
Tel.: +1 604.822.6936
E-mail: ivanov@ece.ubc.ca

Committees

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Organizing Committee

General Chairs
A. Ivanov, U. British Columbia, Canada

Program Committee Chair
B. Kaminska, Simon Fraser U., Canada

Program Vice Chairs
Signals: A. Chatterjee, Georgia Tech, USA; S. Mir, TIMA, France
Sensors: K. Chakrabarty, Duke U., USA
Systems: M. Sawan, Ecole Poly., Canada
Panels:   K. Arabi, Qualcomm, USA

Finance Chair
M. Lubaszewski, UFRGS, Brazil

Publicity Co-Chairs
B. Courtois, CMP, France
F. Azais, LIRMM, France

Publications Chair
D. de Venuto, Polytechnic of Bari, Italy

Local Arrangements
E. Cretu,  U. British Columbia, Canada
 K. Takahata, U. British Columbia, Canada
 B. Stoeber, U. British Columbia, Canada

Program Committee (to include)
J. Abraham, U. Texas, USA
K. Arabi, PMC Sierra, Canada
F. Azais, LIRMM, France
I. Bell, U. Hull, UK
J. Carbonero, ST Microelectronics, France
L. Carro, UFRGS, Brazil
T. Cheng, UCSB, USA
S. Demidenko, U. Monash, Malaysia
J. Figueras, UPC, Spain
G. Force, Texas Instruments, USA
R. Genov, U. Toronto, Canada
B. Grey, Simon Fraser U, Canada
J. Machado da Silva, U Porto, Portugal
C. Metra, U. Bologna, Italy
J.-L. Huang, National U. Taiwan, Taiwan
J. Huertas-Diaz, IMSE-CNM/CSIC, Spain
D. Keezer, Georgia Tech., USA
H. Kerkhoff, MESA/U. Twente, Netherlands
L. Milor, Georgia Tech., USA
F. Novak, Josef Stefan Inst., Slovenia
A. Osseiran, Edith Cowan U., Australia
A. Zjajo, NPX, Netherlands
M. Renovell, LIRMM, France
A. Richardson, U. Lancaster, UK
A. Rueda, U. Sevilla, Spain
Y. Savaria, Ecole Poly., Canada
S. Sattler, Infineon, Germany
M. Slamani, IBM, USA
M. Soma, U. Washington, USA
B. Straube, Fraunhofer IIS/EAS, Germany
S Sunter, LogicVision, USA.
P. Teixeira, INESC, Portugal
C Wegener, Infineon, Germany

For more information, visit us on the web at: http://ims3tw.tttc-events.org

The 14th International Mixed-Signals, Sensors, and Systems Test Workshop (IMS3TW 08) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC), and organized by University of British Columbia.


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

SENIOR PAST CHAIR
Yervant ZORIAN
Virage Logic - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TTTC 2ND VICE CHAIR
Chen-Huan CHIANG

Lucent Technologies
- USA
Tel. +1-732-949-5539
E-mail chenhuan@lucent.com

FINANCE
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

DESIGN & TEST MAGAZINE
Tim CHENG
University of California, Santa Barbara - USA
Tel. +1-805-893-72942
E-mail timcheng@ece.ucsb.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG

Lucent Technologies
- USA
Tel. +1-732-949-5539
E-mail chenhuan@lucent.com

TECHNICAL ACTIVITIES
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

ASIA & SOUTH PACIFIC
Hideo FUJIWARA
Nara Institute of Science and Technology - Japan
Tel. +81-74-372-5220
E-mail fujiwara@is.aist-nara.ac.jp

LATIN AMERICA
Marcelo LUBASZEWSKI
Federal University of Rio Grande do Sul - Brazil
Tel. +34-93-401-6603
E-mail luba@vortex.ufrgs.br

NORTH AMERICA
William R. MANN
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

 

PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 1ST VICE CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

INTERNATIONAL TEST CONFERENCE
Jill E. SIBERT
Raspberry Comm.
- USA
Tel. +1-484-894-1111
E-mail jill_sibert@raspberrycom.com

TEST WEEK COORDINATION
Yervant ZORIAN
Virage Logic - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Piraeus
- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys
- USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Zebo PENG
Linköping University - Sweden
Tel. +46-13-282-067/-281-000
E-mail zpe@ida.liu.se

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it


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